
Prof. L. Jay Guo
Professor of Electrical Electronics and Computer Science,
Director of Macromolecular Science and Engineering,
Affl: Applied Physics & Mechanical Engineering
Office: 2304 EECS
Telephone: 734-647-7718
Email: [email protected]
The Group
Summer 2021


Alumni
Dr. Benjamin Rorem
Intel
Portland, OR
Email: [email protected]
Dr. Taigao Ma
Visa
Austin, TX
Email: [email protected]
Dr. Jennie Paik
PPG
Pittsburgh, PA
Email: [email protected]
Dr. Sungho Lee
Assistant Professor at Dong-A University
Busan, South Korea
Email: [email protected]
Dr. Wei-Kuan Lin
Intel
Email: [email protected]
Dr. Boonjae Jang
LG Chem
Email: [email protected]
Dr. Weijie Feng
Intel
Portland, OR
Email: [email protected]
Dr. Haozhu Wang
Amazon
Chicago, IL
Email: [email protected]
Dr. Changyeong Jeong
Apple
San Jose, CA
Email: [email protected]
Dr. Kaito Yamada
HighRi Optics, Inc.
San Francisco, CA
Email: [email protected]
Dr. Yongbum Park
Apple
Email: [email protected]
Dr. Suneel Joglekar
Postdoc at UM
Ann Arbor, MI
Email: [email protected]
Dr. Sunghyun Nam
LG Chem
Korea
Email: [email protected]
Dr. Saurabh Acharya
Intel
Portland, OR
Email: [email protected]
Dr. Qingyu Cui
Postdoc at UCLA
Los Angeles, CA
Email: [email protected]
Dr. Chengang Ji
CEO, Inlight Technology
Email: [email protected]
Dr. Sangeon Lee
Intel
Chandler, AZ
Email: [email protected]
Dr. Qiaochu Li
Apple
San Diego, CA
Email: [email protected]
Dr. Xi Chen
ASML
San Jose, CA
Email:[email protected]
Dr. Jinhwan Lee
Samsung
Suwon, South Korea
Email: [email protected]
Dr. Long Chen
Amazon
San Diego, CA
Email: [email protected]
Prof. Cheng Zhang
HUST, China
Email: [email protected]
Prof. Dawei Zhao
Sichuan University, China
Email: [email protected]
Dr. Taehee Jang
JMA Wireless
Syracuse, NY
Email: [email protected]
Dr. Ashwin Panday
Micron Inc.
Boise, ID
Email: [email protected]
Dr. Taehwa Lee
Toyota Motor North America R&D Center
Email: [email protected]
Dr. Jing Zhou
Shanghai Institute of Technical Physics, Chinese Academy of Sciences
Email: [email protected]
Dr. Jae Yong Lee
3M
St. Paul, MN
Email: [email protected]
Dr. Kyu Tae Lee
Department of Physics
Inha University, Incheon, Republic of Korea
Email: [email protected]
Prof. Hongseok Youn
Email: [email protected]
Dr. Young Jae Shin
Postdoc, Harvard University
Email: [email protected]
Dr. Yi-Kuei Wu
Google X
Email: [email protected]
Dr. Se Hyun Ahn
Apple
San José, CA
Email:
Prof. Hyoung Won Baac
SKKU, South Korea
Email: [email protected]
Dr. Chung-Yen Chao
Intellisense
Torrance, CA 90501
Email: [email protected]
Prof. Sung-Liang Chen
SJTU-Univ. Michigan Joint Institute
Shanghai, China
Email: [email protected]
Dr. Yi-Hao Chen
Ansys-Lumerical
Email: [email protected]
Prof. Li-Jing Cheng
Oregon State University
Email: [email protected]
Prof. Xing Cheng
SUSTEC
Department of Material Science & Engineering
Email: [email protected]
Dr. Philip Choi
The University of Michigan
Email: [email protected]
Master. Andrew Hollowell
Sandia National Lab
Email: [email protected]
Dr. Myung-Gyu Kang
RF Micro Devices
Email: [email protected]
Dr. Alex Kaplan
Intel Corp.
Email: [email protected]
Moon Kyu Kwak
Kyunpook National University
Email: [email protected]
Professor Dawen Li
University of Alabama
Department of Electrical & Computer Engineering
Email: [email protected]
Dr. Tao Ling
CISCO
Email: [email protected]
Dr. Pran Mukherjee
MIT
Boston, MA
Email: [email protected]
Prof. Jong G. Ok
Department of Mechanical and Automotive Engineering
Seol National University of Science and Technology, Seoul, Korea
Email: [email protected]
Prof. Hui Joon Park
Hanyang University
Email: [email protected]
Dr. Carlos Pina
A-Beam Technology
Email: [email protected]
Dr. Haofei Shi
Chongqing Institute of Green and intelligent Technology
Chinese Academy of Science, China
Email: [email protected]
Prof. Ting Xu
College of Engineering and Applied Sciences
Nanjing University, China
Email: [email protected]